The 25th
European Microelectronics & Packaging Conference (EMPC 2025)
16 - 18 September 2025
World Trade Center, Grenoble | France
Welcome to EMPC 2025 in Grenoble!
The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.
The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.
IMAPS-France looks forward to welcoming you to the beautiful city of Grenoble in September 2025!
Co-sponsored by
Info about abstract submission
The content must be original (previously unpublished), non-confidential and non-commercial. Maximum abstract length: 300-500 words. Figures with appropriate captions, and references, can be included, they do not count in the word limit
Deadline for abstract submission is
January 27, 2025
Gold Sponsor
