The 25th
European Microelectronics  & Packaging Conference (EMPC 2025)

16 - 18 September 2025
World Trade Center, Grenoble | France

Welcome to EMPC 2025 in Grenoble!

The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.

The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

IMAPS-France looks forward to welcoming you to the beautiful city of Grenoble in September 2025!

Co-sponsored by

Info about abstract submission

The content must be original (previously unpublished), non-confidential and non-commercial. Maximum abstract length: 300-500 words. Figures with appropriate captions, and references, can be included, they do not count in the word limit

Deadline for abstract submission is
January 27, 2025