The 25th
European Microelectronics & Packaging Conference (EMPC 2025)
16 - 18 September 2025
World Trade Center, Grenoble | France
Welcome to EMPC 2025 in Grenoble!
The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.
The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.
IMAPS-France looks forward to welcoming you to the beautiful city of Grenoble in September 2025!
Co-sponsored by
Info about abstract submission
The content must be original (previously unpublished), non-confidential and non-commercial. Maximum abstract length: 300-500 words. Figures with appropriate captions, and references, can be included, they do not count in the word limit
Deadline for abstract submission is
January 27, 2025
Gold Sponsor
Bronze Sponsor
