The 25th
European Microelectronics  & Packaging Conference (EMPC 2025)

16 - 18 September 2025
World Trade Center, Grenoble | France

Submissions

Important Dates for Authors:

Abstract submission: January 27, 2025
Extended deadline for abstract submission: February 10, 2025
Notification of authors: April 11, 2025
Full paper submission: June 2, 2025

Conference topics

 Advanced Packaging and System-Integration

  • System in Package
    New SiP developments, SiP testing; Modules in a package, double sided modules, antenna in package; Chip embedding technologies.
  • IC Packaging
    Single- and multi-chip packaging, heterogeneous integration, chiplets, WLP, 2.5D/3D-IC, interposers, high-frequency, and high-power packaging, quilt packaging, logic and memory chip integration.
  • Interconnection Technologies
    Disruptive interconnections, bumping technologies, TSVs and vias; Optical connections, RDLs, 3D printable interconnects.
  • Optoelectronics
    Assembly and packaging technologies for optical and photonics applications; Co-packaged optics, hybrid and heterogeneous photonics integration; Microscopy, imaging, displays; Equipment and tools.

Specialised Topics

  • Power Electronics
    Advances in wide-bandgap semiconductor materials and technologies; Si, GaN, SiC packaging, Ag and Cu sintering, SiC wafer sawing, interconnection technologies, test and reliability.
  • Medical Electronics
    Bio-medical applications, medical devices; Biosensors and bioelectronics; Complying with material and test regulations, and market requirements; Medical imaging.
  • Green Electronics and Sustainability
    Green and sustainable manufacturing; Renewable energy, solar energy, and photovoltaics technologies; Energy storage, battery technologies; Packaging for improved efficiency of photovoltaic modules; Materials recovery and recycling, Product Carbon Footprint; Sustainability and environment.

Materials and Processes

  • Materials
    Solder alloys, materials for harsh environments, solder alternatives, conductive/ nonconductive adhesives, encapsulants, smart materials, TIM, high temperature materials.
  • Substrate Technologies
    Advanced substrate design and technologies, flexible/ stretchable electronics, organic, inorganic, laminates, printed, microfluidics.
  • Assembly & Manufacturing
    Process development, clean room technologies, process and yield enhancements, micromachining, equipment development.
  • Emerging Technologies
    Nanotechnology, sensing technologies, MEMS and NEMS, packaging for extreme harsh environments.
  • Smart manufacturing
    AI-enabled technologies, Additive Manufacturing, assembly factory automation.

Design, Modelling and Reliability

  • Design, Modelling and Simulation
    Signal integrity analysis, thermal management, cooling solutions; Electro-magnetic, thermal, and mechanical simulation; Physics-of-failure modelling, virtual qualification, data-driven modelling, model order reduction, optimisation.
  • Inspection and Test
    New characterisation, inspection and tests methods, measurement and qualification test methodologies, advances in metrology and test equipment; Accelerated life testing, failure detection and analysis; AI for test, standards.
  • Quality and Reliability
    Quality assurance, monitoring and control, counterfeits; Reliability at component, board and system-level; In-service reliability, prognostics, health management, lifetime models. 

Markets and Developments

 

  • Markets
    Telecoms (5G/6G), IoT, quantum technologies, computing, mobile, automotive, EVs, aerospace, defence and security, high reliability applications, robotics, consumer, wearables and smart textiles, structural, smart cities.
  • Business Aspects
    Cost and cycle time reduction, markets and supply chains, distribution, intellectual property, policy issues, obsolescence, business models.
  • Education for Electronics
    Educational and information technologies for electronics manufacturing, new approaches and standards in electronics education.