
The 25th
European Microelectronics & Packaging Conference (EMPC 2025)
16 - 18 September 2025
World Trade Center, Grenoble | France
Submissions
Important Dates for Authors:
Abstract submission: January 27, 2025
Extended deadline for abstract submission: February 10, 2025
Notification of authors: April 11, 2025
Full paper submission: June 2, 2025
Conference topics
Advanced Packaging and System-Integration
- System in Package
New SiP developments, SiP testing; Modules in a package, double sided modules, antenna in package; Chip embedding technologies. - IC Packaging
Single- and multi-chip packaging, heterogeneous integration, chiplets, WLP, 2.5D/3D-IC, interposers, high-frequency, and high-power packaging, quilt packaging, logic and memory chip integration. - Interconnection Technologies
Disruptive interconnections, bumping technologies, TSVs and vias; Optical connections, RDLs, 3D printable interconnects. - Optoelectronics
Assembly and packaging technologies for optical and photonics applications; Co-packaged optics, hybrid and heterogeneous photonics integration; Microscopy, imaging, displays; Equipment and tools.
Specialised Topics
- Power Electronics
Advances in wide-bandgap semiconductor materials and technologies; Si, GaN, SiC packaging, Ag and Cu sintering, SiC wafer sawing, interconnection technologies, test and reliability. - Medical Electronics
Bio-medical applications, medical devices; Biosensors and bioelectronics; Complying with material and test regulations, and market requirements; Medical imaging. - Green Electronics and Sustainability
Green and sustainable manufacturing; Renewable energy, solar energy, and photovoltaics technologies; Energy storage, battery technologies; Packaging for improved efficiency of photovoltaic modules; Materials recovery and recycling, Product Carbon Footprint; Sustainability and environment.
Materials and Processes
- Materials
Solder alloys, materials for harsh environments, solder alternatives, conductive/ nonconductive adhesives, encapsulants, smart materials, TIM, high temperature materials. - Substrate Technologies
Advanced substrate design and technologies, flexible/ stretchable electronics, organic, inorganic, laminates, printed, microfluidics. - Assembly & Manufacturing
Process development, clean room technologies, process and yield enhancements, micromachining, equipment development. - Emerging Technologies
Nanotechnology, sensing technologies, MEMS and NEMS, packaging for extreme harsh environments. - Smart manufacturing
AI-enabled technologies, Additive Manufacturing, assembly factory automation.
Design, Modelling and Reliability
- Design, Modelling and Simulation
Signal integrity analysis, thermal management, cooling solutions; Electro-magnetic, thermal, and mechanical simulation; Physics-of-failure modelling, virtual qualification, data-driven modelling, model order reduction, optimisation. - Inspection and Test
New characterisation, inspection and tests methods, measurement and qualification test methodologies, advances in metrology and test equipment; Accelerated life testing, failure detection and analysis; AI for test, standards. - Quality and Reliability
Quality assurance, monitoring and control, counterfeits; Reliability at component, board and system-level; In-service reliability, prognostics, health management, lifetime models.
Markets and Developments
- Markets
Telecoms (5G/6G), IoT, quantum technologies, computing, mobile, automotive, EVs, aerospace, defence and security, high reliability applications, robotics, consumer, wearables and smart textiles, structural, smart cities. - Business Aspects
Cost and cycle time reduction, markets and supply chains, distribution, intellectual property, policy issues, obsolescence, business models. - Education for Electronics
Educational and information technologies for electronics manufacturing, new approaches and standards in electronics education.