The 25th
European Microelectronics & Packaging Conference (EMPC 2025)

16 - 18 September 2025
World Trade Center, Grenoble | France

Technical Committee

Wilfrid Aklamavo, SERMA MICROELECTRONICS, France
Mariya Aleksandrova, Technical University of Sofia, Bulgaria
Apostol Apostolov, Bulgarian Academy of Sciences, Bulgaria
Rolf Aschenbrenner, Fraunhofer IZM, Germany
Laurent Barreau, ST Microelectronics, France
Sidahmed Beddar, VALEO, France
Anandaroop Bhattacharya, IIT Kharagpur, India
Olivier Billaud, VALEO LIGHT, France
Cyril Buttay, CNRS / Laboratoire Ampere, France
Luigi Calligarich, Electron Mec srl, Italy
Emilian Ceuca, University of Alba Iulia, Romania
Norocel Codreanu, POLITEHNICA Bucharest, Romania
Romain Coffy, STMicroelectronics, France
Suzanne Costello, Forensic Eyes, United Kingdom
Pascal Couderc, France
Walter de Munnik, JCET, The Netherlands
Jean-luc Diot, ASSEMBLINNOV, France
Franck Dosseul, MODULEUS, France
Bradford J. Factor, ASE, France
Christopher Gourlay, Imperial College London, United Kingdom
Gabor Harsanyi, Budapest University of Technology and Economics, Hungary
Sheikh Hassan, University of Greenwich, United Kingdom
Daniel Hubert, VALEO, France
Gabriel Kopp, VALEO, France
Ricky S W Lee, HKUST, Hong Kong
Tekfouy Lim, Fraunhofer IZM, Germany
Voya Markovich, United States
Laurent Mendizabal, CEA – LETI, France
Jens Müller, TU Ilmenau, Germany
Hiroshi Nishikawa, Osaka University, Japan
Ali Roshanghias, Silicon Austria Labs GmbH, Austria
Mark Shaw, STMicroelectronics, Italy
Jean-Charles Souriau, CEA-Leti, France
Stoyan Stoyanov, University of Greenwich, United Kingdom
Martino Taddei, GESTLABS S.r.l, Italy
Alexandre Val, VALEO, France
Valérie Volant, STM, France
Nadia Wazad, AIRBUS DEFENCE AND SPACE, France
Chunyan Yin, Southeast University, China
Sung-Uk Zhang, Dong-Eui University, South Korea
Christophe Zinck, ASE Group, France
Zdravko Zojceski, VALEO, France