The 25th
European Microelectronics & Packaging Conference (EMPC 2025)

16 - 18 September 2025
World Trade Center, Grenoble | France

Workshop

Pre-Brokerage for Lab to Fab Accelerator Projects on Advanced Packaging

We invite you to join the Workshop “Pre-Brokerage for Lab to Fab Accelerator Projects on Advanced Packaging”, taking place onsite in Grenoble at the World Trade Center on September 18, 2025, from 3:30pm to 5:30pm, as part of EMPC 2025. Organized by Chips Joint Undertaking (Chips JU) and EPoSS, this workshop will present the scope and objectives of two upcoming calls for Advanced Packaging, recently pre-announced by Chips JU. It will provide insights into funding opportunities and serve as a platform to initiate consortium building for future project proposals. The session is particularly relevant for stakeholders from industry, research, and innovation in microelectronics and packaging technologies.

Register for the workshopDraft call details