The 25th
European Microelectronics & Packaging Conference (EMPC 2025)
16 - 18 September 2025
World Trade Center, Grenoble | France
IEEE EPS Distinguished Lecture
Wednesday, 15/Sept/2025, 5:00pm – 6:00pm
Location: Amphitheatre
"Recent Advances and Trends in Packaging"
John Lau
Unimicron Technology Corporation
John Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 535 peer-reviewed papers (385 are the principal investigator), 52 issued and pending US patents (31 are the principal inventor), and 24 textbooks (all are the first author). John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.
Abstract
Packaging technologies such as Cu-Cu hybrid bonding, bridges embedded in build-up package substrate, bridges embedded in fan-out epoxy molding compound with redistribution-layer, HBM vs. cHBM, CoWoS vs. CoPoS, CoWoS-S vs. CoWoS-R vs. CoWoS-L, 3.3D IC Integration, and 3.5D IC integration will be discussed in this lecture. Some recommendations will be provided.
John Lau
Unimicron Technology Corporation
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