
The 25th
European Microelectronics & Packaging Conference (EMPC 2025)
16 - 18 September 2025
World Trade Center, Grenoble | France
Workshop
Pre-Brokerage for Lab to Fab Accelerator Projects on Advanced Packaging
We invite you to join the Workshop “Pre-Brokerage for Lab to Fab Accelerator Projects on Advanced Packaging”, taking place onsite in Grenoble at the World Trade Center on September 18, 2025, from 3:30pm to 5:30pm, as part of EMPC 2025. Organized by Chips Joint Undertaking (Chips JU) and EPoSS, this workshop will present the scope and objectives of two upcoming calls for Advanced Packaging, recently pre-announced by Chips JU. It will provide insights into funding opportunities and serve as a platform to initiate consortium building for future project proposals. The session is particularly relevant for stakeholders from industry, research, and innovation in microelectronics and packaging technologies.