Abstract Submission

The content must be original (previously unpublished), non-confidential and non-commercial. Maximum abstract length: 400-800 words. Figures with appropriate captions, and references, can be included, they do not count in the word limit.

Deadline for abstract submission is January 27, 2025

Conference topics

 Advanced Packaging and System-Integration

• System in Package
  New SiP developments, SiP testing; Modules in a package, double sided modules, antenna in package; Chip embedding technologies.
• IC Packaging
  Single- and multi-chip packaging, heterogeneous integration, chiplets, WLP, 2.5D/3D-IC, interposers, high-frequency, and high-power packaging, quilt packaging, logic and memory chip integration.
• Interconnection Technologies
  Disruptive interconnections, bumping technologies, TSVs and vias; Optical connections, RDLs, 3D printable interconnects.
• Optoelectronics
  Assembly and packaging technologies for optical and photonics applications; Co-packaged optics, hybrid and heterogeneous photonics integration; Microscopy, imaging, displays; Equipment and tools.

Specialised Topics

• Power Electronics
  Advances in wide-bandgap semiconductor materials and technologies; Si, GaN, SiC packaging, Ag and Cu sintering, SiC wafer sawing, interconnection technologies, test and reliability.
• Medical Electronics
  Bio-medical applications, medical devices; Biosensors and bioelectronics; Complying with material and test regulations, and market requirements; Medical imaging.
• Green Electronics and Sustainability
  Green and sustainable manufacturing; Renewable energy, solar energy, and photovoltaics technologies; Energy storage, battery technologies; Packaging for improved efficiency of photovoltaic modules; Materials recovery and recycling, Product Carbon Footprint; Sustainability and environment.

Materials and Processes

• Materials
  Solder alloys, materials for harsh environments, solder alternatives, conductive/ nonconductive adhesives, encapsulants, smart materials, TIM, high temperature materials.
• Substrate Technologies
  Advanced substrate design and technologies, flexible/ stretchable electronics, organic, inorganic, laminates, printed, microfluidics.
• Assembly & Manufacturing
  Process development, clean room technologies, process and yield enhancements, micromachining, equipment development.
• Emerging Technologies
  Nanotechnology, sensing technologies, MEMS and NEMS, packaging for extreme harsh environments.
• Smart manufacturing
  AI-enabled technologies, Additive Manufacturing, assembly factory automation.

Design, Modelling and Reliability

• Design, Modelling and Simulation
  Signal integrity analysis, thermal management, cooling solutions; Electro-magnetic, thermal, and mechanical simulation; Physics-of-failure modelling, virtual qualification, data-driven modelling, model order reduction, optimisation.
• Inspection and Test
  New characterisation, inspection and tests methods, measurement and qualification test methodologies, advances in metrology and test equipment; Accelerated life testing, failure detection and analysis; AI for test, standards.
• Quality and Reliability
  Quality assurance, monitoring and control, counterfeits; Reliability at component, board and system-level; In-service reliability, prognostics, health management, lifetime models. 

Markets and Developments

• Markets
  Telecoms (5G/6G), IoT, quantum technologies, computing, mobile, automotive, EVs, aerospace, defence and security, high reliability applications, robotics, consumer, wearables and smart textiles, structural, smart cities.
• Business Aspects
  Cost and cycle time reduction, markets and supply chains, distribution, intellectual property, policy issues, obsolescence, business models.
• Education for Electronics
  Educational and information technologies for electronics manufacturing, new approaches and standards in electronics education.