The 25th
European Microelectronics & Packaging Conference (EMPC 2025)

16 - 18 September 2025
World Trade Center, Grenoble | France

Submissions

Important Dates for Authors:

Abstract submission: January 27, 2025
Extended deadline for abstract submission: February 10, 2025
Notification of authors: April 11, 2025
Full paper submission: June 2, 2025

The deadline for abstract submission has already passed. Authors have recently been informed about the acceptance of their contributions.

As a next step, we kindly ask all authors whose abstract has been accepted as an oral or poster presentation to submit a full paper of 5 to 8 pages. Papers can be uploaded only as pdf file and not as Word file or in any other format. The deadline for paper upload is June 2, 2025. Please be sure to use the templates provided by IEEE and linked below for paper preparation.

Downloads

Word – Template: Download here

Latex – Template: Download here

The paper upload in ConfTool will open at the beginning of May. Before uploading your paper to ConfTool, the file must be checked by the IEEE PDF eXpress Checker to ensure that all formal requirements are met. Here is the link to the IEEE PDF eXpress Checker: https://ieee-pdf-express.org/account/login?ReturnUrl=%2F. The conference ID will be made available soon.

An electronic version of the papers will be distributed at the event; and will also be available through IMAPS Source and IEEE Xplore after the conference.

Registration for the conference will open soon. Please remember that for every accepted paper one person from the group of authors will have to register at the author rate. We kindly ask you to register by the end of the early bird phase on June 16, 2025 at the latest.

If you have questions concerning the paper upload, please contact the conference office at office@empc2025.org.

 

Conference topics

 Advanced Packaging and System-Integration

  • System in Package
    New SiP developments, SiP testing; Modules in a package, double sided modules, antenna in package; Chip embedding technologies.
  • IC Packaging
    Single- and multi-chip packaging, heterogeneous integration, chiplets, WLP, 2.5D/3D-IC, interposers, high-frequency, and high-power packaging, quilt packaging, logic and memory chip integration.
  • Interconnection Technologies
    Disruptive interconnections, bumping technologies, TSVs and vias; Optical connections, RDLs, 3D printable interconnects.
  • Optoelectronics
    Assembly and packaging technologies for optical and photonics applications; Co-packaged optics, hybrid and heterogeneous photonics integration; Microscopy, imaging, displays; Equipment and tools.

Specialised Topics

  • Power Electronics
    Advances in wide-bandgap semiconductor materials and technologies; Si, GaN, SiC packaging, Ag and Cu sintering, SiC wafer sawing, interconnection technologies, test and reliability.
  • Medical Electronics
    Bio-medical applications, medical devices; Biosensors and bioelectronics; Complying with material and test regulations, and market requirements; Medical imaging.
  • Green Electronics and Sustainability
    Green and sustainable manufacturing; Renewable energy, solar energy, and photovoltaics technologies; Energy storage, battery technologies; Packaging for improved efficiency of photovoltaic modules; Materials recovery and recycling, Product Carbon Footprint; Sustainability and environment.

Materials and Processes

  • Materials
    Solder alloys, materials for harsh environments, solder alternatives, conductive/ nonconductive adhesives, encapsulants, smart materials, TIM, high temperature materials.
  • Substrate Technologies
    Advanced substrate design and technologies, flexible/ stretchable electronics, organic, inorganic, laminates, printed, microfluidics.
  • Assembly & Manufacturing
    Process development, clean room technologies, process and yield enhancements, micromachining, equipment development.
  • Emerging Technologies
    Nanotechnology, sensing technologies, MEMS and NEMS, packaging for extreme harsh environments.
  • Smart manufacturing
    AI-enabled technologies, Additive Manufacturing, assembly factory automation.

Design, Modelling and Reliability

  • Design, Modelling and Simulation
    Signal integrity analysis, thermal management, cooling solutions; Electro-magnetic, thermal, and mechanical simulation; Physics-of-failure modelling, virtual qualification, data-driven modelling, model order reduction, optimisation.
  • Inspection and Test
    New characterisation, inspection and tests methods, measurement and qualification test methodologies, advances in metrology and test equipment; Accelerated life testing, failure detection and analysis; AI for test, standards.
  • Quality and Reliability
    Quality assurance, monitoring and control, counterfeits; Reliability at component, board and system-level; In-service reliability, prognostics, health management, lifetime models. 

Markets and Developments

 

  • Markets
    Telecoms (5G/6G), IoT, quantum technologies, computing, mobile, automotive, EVs, aerospace, defence and security, high reliability applications, robotics, consumer, wearables and smart textiles, structural, smart cities.
  • Business Aspects
    Cost and cycle time reduction, markets and supply chains, distribution, intellectual property, policy issues, obsolescence, business models.
  • Education for Electronics
    Educational and information technologies for electronics manufacturing, new approaches and standards in electronics education.